Samsung

Samsung Exynos Packaging Concepts

on May 25 | with No Comments
in Asia, Australia, Concept Packaging, Korea, Oceania | , , , , , |

Samsung Exynos Packaging

© 2016 minimalist

Due to the high demand for Samsung Exynos, Samsung Electronics have decided to expend Exynos from a processor chip into a reference platform.

“The Samsung Reference Platform is the official reference platform powered by Exynos solutions and provides an easy development environment with the essential functionalities and the latest technologies. Developers are able to modify their devices or software by referring to the Samsung Reference Platform.”

minimalist have carefully visualise its performance and functionality and came up with the graphic patterns which represent high and efficient performance in data transmission.

The packaging consists of a series of sleek acrylic pillars that securely contend the mobile as well as an information panel. Outside the foiled hardcase box completes the sophisticated package.

Designed by: minimalist  , Wonchan Lee, Korea/Asutralia.

 

Samsung1

Samsung3

 

Samsung4

Samsung5

Samsung6

Samsung7

Samsung8

Samsung9

Samsung10

Samsung11

Samsung12

Samsung13

Samsung14

Samsung15

Samsung16

Samsung17

Samsung18

Samsung19

Samsung20

Samsung21

Samsung22

Samsung23

Samsung24

Samsung25

Samsung26

Samsung27

 

 

 

Pin It
Share on Tumblr

related posts

Leave a Reply

Your email address will not be published. Required fields are marked *

9 − 2 =

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

« »